Semiconductor 2017 new generation of process technology will enter the mass production stage, and most of the consumer application design, especially mobile phone chip. According to Electronic Design, chips identified using 10-nanometer processes include Samsung Electronics and Qualcomm's Snapdragon 835, MediaTek Helio X30 processors and LG Electronics' next-generation processors.
Intel has been using a 14-nanometer advanced process to produce microprocessors for some time, and CEO Brian Krzanich demonstrated a 2-in-1 device with Intel's latest 10-nanometer Cannonlake processor at the Consumer Electronics Show (CES) in 2017 The Although the industry for the 10-nanometer definition is still controversial, but it is certain that all manufacturers have begun to build 10-nanometer products.
In addition, many people also guess Apple (Apple) iPhone 8 (tentatively said) is likely to include A11 Fusion chip, including a series of 10-nanometer process components, but the answer still have to wait until the iPhone 8 release to confirm.
Market data agency International Business Strategies data show that 2017 10-nanometer chip market will reach 500 million US dollars scale, which means that the relevant products will mushroom. As for the 10-nanometer how can revenue within a year to reach 10% of the market close to the main reasons there are two, one is several wafer foundry technology at the same time to enhance, followed by the design of the fab, manufacturers use as much as possible Previous process technology and wafer fabrication equipment to reduce the cost and time of mass production. And maintain consistency between processes, reduce operating costs and accelerate progress.
For example, TSMC in 2016 open innovation platform and technical forum activities have said that the company in 20 to 16 nm, 16 to 10 nanometers and 10 to 7 nanometers after the maintenance of 90% of the versatility of process equipment. The first wave of process design in 2016 into the risk of mass production, 2017 these designs and other designs will enter the mass production stage, is expected to be the main kinetic energy from high-end mobile devices, large data (Big Data) and data center use of high-performance computing needs.
7 nm in lithography technology and time course are significantly different from the past process, Samsung will show that will be 7 nm process into the extreme ultraviolet light (EUV) lithography technology, TSMC and GlobalFoundries will first 193i scanner and multiple exposure Strategy-based. Although each multiple exposure method is not exactly the same, the goal is to pursue a significant reduction in changes and impressions.If you want to learn more information,please go to electronic component distributors website.
In 2010, there will be 10 nanometer process variation products, such as Samsung has announced the third generation of 10 nanometer process technology (10LPU), TSMC continued to improve the N16, from N16FF + to N12, reduce the chip size to meet the needs of low power consumption.
For low-power products such as general sensors, image sensors, and application processors for mobile / telematics (IoT), GlobalFoundries also introduces the 22FDX and 12FDX low-power platforms for Internet of Things applications.
10 nanometer design of the wafer starts and revenue will grow, 7-nanometer early adopters will complete the test chip design and order. 0.18 micron, 130nm, 65nm, 45/40 nanometer and 28nm process, design tools and rules will continue to improve due to the application of Internet of Things to meet the market needs of complex and ultra-low power design.